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Surface mount technology with fine pitch components: the manufacturing issues
Tipo de material:
TextoIdioma: Inglés Detalles de publicación: Londres: Champ & Hall; 1995Descripción: 236 páginas: ilustraciones, fotografías; 24 cmISBN: - 0-412-55340-6
- 621.3.049/D15
Contenidos:
1. Introduction -- 2. Economic aspects of manufacturing -- 3. Driving forces in electronics -- 4. Basic properties of solder materials -- 5. Printing of solder pastes for fine pitch components -- 6. The printing process -- 7. The soldering process -- 8. Parameters influencing soldering results -- 9. Optimization of soldering results -- 10. Design-related manufacturing problems -- 11. Manufacturing problems specific to fine pitch components -- 12. Soldering process influence on component reliability -- 13. Limitations of current surface mount technology and new package types -- 14. Future msnufacturing technologies
| Tipo de ítem | Biblioteca actual | Colección | Signatura topográfica | Estado | Código de barras | |
|---|---|---|---|---|---|---|
Libros
|
Jicamarca | Colección Bibliográfica | 621.3.049/D15 (Navegar estantería(Abre debajo)) | Disponible | ROJ0000149 |
Total de reservas: 0
Incluye índice: páginas 237-242
1. Introduction -- 2. Economic aspects of manufacturing -- 3. Driving forces in electronics -- 4. Basic properties of solder materials -- 5. Printing of solder pastes for fine pitch components -- 6. The printing process -- 7. The soldering process -- 8. Parameters influencing soldering results -- 9. Optimization of soldering results -- 10. Design-related manufacturing problems -- 11. Manufacturing problems specific to fine pitch components -- 12. Soldering process influence on component reliability -- 13. Limitations of current surface mount technology and new package types -- 14. Future msnufacturing technologies
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