000			01321nam a22002417a 4500
999			_c12625 _d12625
003			OSt
005			20200204102335.0
008			200204b1995 -usao fr |||0 0 eng d
020			_a0-412-55340-6
040			_apeliigp _bspa _cpeliigp
041			_aeng
082	0	4	_2621.3.049/D15
100		1	_4autor _92910 _aDanielsson, Hans
245			_aSurface mount technology with fine pitch components: _bthe manufacturing issues
260			_aLondres: _bChamp & Hall; _c1995
300			_a236 páginas: _bilustraciones, fotografías; _c24 cm
500			_aIncluye índice: páginas 237-242
505			_a1. Introduction -- 2. Economic aspects of manufacturing -- 3. Driving forces in electronics -- 4. Basic properties of solder materials -- 5. Printing of solder pastes for fine pitch components -- 6. The printing process -- 7. The soldering process -- 8. Parameters influencing soldering results -- 9. Optimization of soldering results -- 10. Design-related manufacturing problems -- 11. Manufacturing problems specific to fine pitch components -- 12. Soldering process influence on component reliability -- 13. Limitations of current surface mount technology and new package types -- 14. Future msnufacturing technologies
650	1	4	_2SOLDADURA
650	2	4	_2TECNOLOGÍA AVANZADA
910			_aslz
942			_2ddc _cBK