TY  - BOOK
AU  - Danielsson, Hans
TI  - Surface mount technology with fine pitch components: the manufacturing issues
SN  - 0-412-55340-6
PY  - 1995///
CY  - Londres
PB  - Champ & Hall
KW  - SOLDADURA
KW  - TECNOLOGÍA AVANZADA
N1  - Incluye índice: páginas 237-242; 1. Introduction -- 2. Economic aspects of manufacturing -- 3. Driving forces in electronics -- 4. Basic properties of solder materials -- 5.  Printing of solder pastes for fine pitch components -- 6. The printing process -- 7. The soldering process -- 8. Parameters influencing soldering results -- 9. Optimization of soldering results -- 10. Design-related manufacturing problems -- 11. Manufacturing problems specific to fine pitch components -- 12. Soldering process influence on component reliability -- 13. Limitations of current surface mount technology and new package types -- 14. Future msnufacturing technologies
ER  -