Surface mount technology with fine pitch components: the manufacturing issues
Tipo de material: TextoEditor: Londres: Champ & Hall; 1995Descripción: 236 páginas: ilustraciones, fotografías; 24 cm.ISBN: 0-412-55340-6.Tema(s): | Clasificación CDD:Tipo de ítem | Colección | Signatura | Estado | Código de barras |
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Libros | Colección Bibliográfica | 621.3.049/D15 (Navegar estantería) | Disponible | ROJ0000149 |
Navegando Jicamarca Estantes , Código de colección: Colección Bibliográfica Cerrar el navegador de estanterías
621.3.049.77/K49 Introduction to integrated semiconductor circuits | 621.3.049/C26 Ej. 1 Transistor circuits and applications | 621.3.049/C26 Ej. 2 Transistor circuits and applications | 621.3.049/D15 Surface mount technology with fine pitch components: | 621.3.049/F47 Theory of A-C circuits | 621.3.049/H37 Contemporary electronics circuits deskbook | 621.3.049/I61 Installation and tutorial guide for the PC |
Incluye índice: páginas 237-242
1. Introduction -- 2. Economic aspects of manufacturing -- 3. Driving forces in electronics -- 4. Basic properties of solder materials -- 5. Printing of solder pastes for fine pitch components -- 6. The printing process -- 7. The soldering process -- 8. Parameters influencing soldering results -- 9. Optimization of soldering results -- 10. Design-related manufacturing problems -- 11. Manufacturing problems specific to fine pitch components -- 12. Soldering process influence on component reliability -- 13. Limitations of current surface mount technology and new package types -- 14. Future msnufacturing technologies